代表论文
1. Y. Tong and Q. Chen, "Analytical Modeling of Multiple Co-Existing Inaccuracies in RF Controlling Circuits for Superconducting Quantum Computing," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, doi: 10.1109/TCAD.2023.3311732
2. C. Wang, D. Yang, J. Lyu, Y. Dai, C. Zhuo and Q. Chen, "On Model Order Reduction and Exponential Integrator for Transient Circuit Simulation," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, doi: 10.1109/TCAD.2023.3309734.
3. C. Wang, D. Yang and Q. Chen, “EI-MOR: A Hybrid Exponential Integrator and Model Order Reduction Approach for Transient Power/Ground Network Analysis”, in Proc. Intl. Conf. on Computer-Aided Design (ICCAD), San Diego, Nov. 2022
4. D. Liu and Q. Chen, “TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs,” in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2022.
5. Q. Chen, “EI-NK: A Robust Exponential Integrator Method with Singularity Removal and Newton-Raphson Iterations for Transient Nonlinear Circuit Simulation”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 6, pp. 1693-1703, June 2022.
6. T. Hou, P. Zhen, N. Wong; Q. Chen, G. Shi, S. Wang and H. B. Chen “Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires,” in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), May 2022.
7. T. Hou, N. Wong, Q. Chen, Z. Ji and H. -B. Chen, “A Space-Time Neural Network for Analysis of Stress Evolution under DC Current Stressing,” in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, (TCAD), Apr. 2022.
8. M. Zhang, J. Li, C. Yang, and Q. Chen, “Deflated Restarting of Exponential Integrator Method with an Implicit Regularization for Efficient Transient Circuit Simulation,” Electronics, vol. 10, no. 9, p. 1124, May 2021.
9. Q. Chen, “A Robust Exponential Integrator Method for Generic Nonlinear Circuit Simulation”, Design Automation Conference (DAC), San Francisco, Jul. 2020
10. Chen, W. Schoenmaker, S.-H. Weng, C.-K. Cheng, G.-H. Chen, L.-J. Jiang and N. Wong, “A fast time-domain EM-TCAD coupled simulation framework via matrix exponential with stiffness reduction,” Intl. Journal of Circuit Theory and Applications (IJCTA), vol. 44, no. 4, pp. 833-850, Apr. 2016.
11. Zhuang, X. Wang, Q. Chen, P. Chen, and C.K. Cheng, “From Circuit Theory, Simulation to SPICE_Diego: A Matrix Exponential Approach for Time-Domain Analysis of Large-Scale Circuits,” IEEE Circuits and Systems Magazine, pp. 16-34, issue 2, 2016. (Invited Paper)
12. G. Mei, W. Schoenmaker and Q. Chen, “An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 35, no. 5, pp. 832-843, Oct. 2015.
13. Chen, J. Li, C. Y. Yam, Y. Zhang, N. Wong and G. H. Chen, “An approximate framework for quantum transport calculation with model order reduction”, Journal of Computational Physics (JCP), 286, pp. 49-61, 2015.
14. Schoenmaker, Q. Chen and P. Galy, “Computation of self-induced magnetic field effects including the Lorentz force for fast-transient phenomena in integrated-circuit devices”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 33, no. 6, pp. 893-902, Jun. 2014.
15. Meng, Z. Yin, C. Y. Yam, S. Koo, Q. Chen, N. Wong and G. H. Chen, “Frequency-domain multiscale quantum mechanics/electromagnetics simulation method”, Journal of Computational Chemistry (JCC), vol. 139, no. 24, pp. 244111, Dec. 2013.
16. Y. Yam, J. Peng, Q. Chen, S. Markov, J. Z. Huang, N. Wong, W. C. Chew and G. H. Chen, “A multi-scale modeling of junctionless field-effect transistors”, Applied Physics Letters (APL), vol. 103, no. 6, pp. 062109 (1-5), Aug. 2013.
17. Q. Chen, S. L. Ho and W. N. Fu, “A new low radiation wireless transmission system in mobile phone application based on magnetic resonant coupling”, IEEE Trans. on Magnetics (TMAG), vol. 49, no. 7, pp. 3476-3479, Jul. 2013.
18. Q. Chen, W. Schoenmaker, G. H. Chen, L. J. Jiang and N. Wong, “A numerically efficient formulation for time-domain electromagnetic-semiconductor co-simulation for fast-transient systems”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 32, no. 5, pp. 802-806, May 2013.
19. Q. Chen, S. L. Ho, and W. N. Fu, “Numerical investigation of magnetic resonant coupling technique in inter-chip communication via electromagnetics-TCAD coupled simulation”, IEEE Trans. on Magnetics (TMAG), vol. 48, no. 11, pp. 4253-4256, Oct. 2012.
20.H. Weng, Q. Chen, and C. K. Cheng, “Time-domain analysis of large-scale circuits by matrix exponential method with adaptive control”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 31, no. 8, pp. 1180-1193, Aug. 2012.
21. Q. Chen, S. H. Weng, and C. K. Cheng, “A practical regularization technique for modified nodal analysis in large-scale time-domain circuit simulation”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 31, no. 7, pp. 1031-1040, Jul. 2012.
22. Meng, C. Y. Yam, S. Koo, Q. Chen, N. Wong, and G. H. Chen, “Dynamic multiscale quantum mechanics/electromagnetics simulation method”, Journal of Chemical Theory and Computation (JCTC), vol. 8, no. 4, pp. 1190-1199, Feb. 2012.
23. Y. Yam, L. Y. Meng, G. H. Chen, Q. Chen and N. Wong, “Multiscale quantum mechanics/electromagnetics simulation for electronic devices”, Journal of Physical Chemistry Chemical Physics (PCCP), vol. 13, no. 32, pp. 14365-14369, Jun. 2011. (Invited Paper)
24. Chen, W. Schoenmaker, P. Meuris and N. Wong, “An effective formulation of coupled electromagnetic-TCAD simulation for extremely high frequency onwards”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 30, no. 6, pp. 866-876, Jun. 2011.
学术服务
1. 技术委员会成员: DAC (2022,2023), ICCAD (2023), ASP-DAC(2016 and 2017),ICTA (2020,2021).
2. 审稿人: IEEE Transactions on Computer-Aided Design for Integrated Circuits (TCAD), IEEE Transactions on Magnetics (TMAG), IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT), IEEE Transactions on Advanced Packaging (TADVP) and IEEE Journal on Multiscale and Multiphysics Computational Techniques (JMMCT)等.