题名 | Technology Roadmap for Flexible Sensors |
作者 | Luo,Yifei1,2; Abidian,Mohammad Reza3; Ahn,Jong Hyun4; Akinwande,Deji5,6; Andrews,Anne M.7; Antonietti,Markus8; Bao,Zhenan9; Berggren,Magnus10,11; Berkey,Christopher A.12; Bettinger,Christopher John13; Chen,Jun14; Chen,Peng15; Cheng,Wenlong16,17; Cheng,Xu18; Choi,Seon Jin19; Chortos,Alex20; Dagdeviren,Canan21; Dauskardt,Reinhold H.12; Di,Chong An22; Dickey,Michael D.23; Duan,Xiangfeng24; Facchetti,Antonio25; Fan,Zhiyong26; Fang,Yin15; Feng,Jianyou27; Feng,Xue28; Gao,Huajian29,30; Gao,Wei31; Gong,Xiwen32; Guo,Chuan Fei33; Guo,Xiaojun34; Hartel,Martin C.14; He,Zihan22; Ho,John S.35,36,37; Hu,Youfan38; Huang,Qiyao39; Huang,Yu40; Huo,Fengwei41; Hussain,Muhammad M.42; Javey,Ali43,44; Jeong,Unyong45; Jiang,Chen46; Jiang,Xingyu47; Kang,Jiheong48; Karnaushenko,Daniil49; Khademhosseini,Ali50; Kim,Dae Hyeong51; Kim,Il Doo52; Kireev,Dmitry5,6; Kong,Lingxuan15; Lee,Chengkuo36,53,54,55; Lee,Nae Eung56; Lee,Pooi See57,58; Lee,Tae Woo59,60,61,62; Li,Fengyu63; Li,Jinxing64; Liang,Cuiyuan65; Lim,Chwee Teck66,67,68; Lin,Yuanjing69; Lipomi,Darren J.70; Liu,Jia71; Liu,Kai72; Liu,Nan73; Liu,Ren71; Liu,Yuxin1,74; Liu,Yuxuan75; Liu,Zhiyuan76; Liu,Zhuangjian30; Loh,Xian Jun1; Lu,Nanshu77; Lv,Zhisheng1; Magdassi,Shlomo78; Malliaras,George G.79; Matsuhisa,Naoji80; Nathan,Arokia81; Niu,Simiao82; Pan,Jieming36; Pang,Changhyun83; Pei,Qibing84; Peng,Huisheng27; Qi,Dianpeng65; Ren,Huaying85; Rogers,John A.86,87; Rowe,Aaron88,89; Schmidt,Oliver G.49,90,91; Sekitani,Tsuyoshi92; Seo,Dae Gyo59; Shen,Guozhen93; Sheng,Xing94; Shi,Qiongfeng36,53,54; Someya,Takao95; Song,Yanlin96; Stavrinidou,Eleni97; Su,Meng96; Sun,Xuemei27; Takei,Kuniharu98; Tao,Xiao Ming99; Tee,Benjamin C.K.100,101; Thean,Aaron Voon Yew36,102; Trung,Tran Quang56; Wan,Changjin103; Wang,Huiliang104; Wang,Joseph105; Wang,Ming106,107; Wang,Sihong108; Wang,Ting109; Wang,Zhong Lin110,111; Weiss,Paul S.112; Wen,Hanqi15,113; Xu,Sheng114; Xu,Tailin115; Yan,Hongping9; Yan,Xuzhou72; Yang,Hui116; Yang,Le1,117; Yang,Shuaijian118; Yin,Lan119; Yu,Cunjiang120; Yu,Guihua121; Yu,Jing57; Yu,Shu Hong122; Yu,Xinge123; Zamburg,Evgeny36,102; Zhang,Haixia124,125; Zhang,Xiangyu36,102; Zhang,Xiaosheng126; Zhang,Xueji115; Zhang,Yihui18; Zhang,Yu36,102; Zhao,Siyuan71; Zhao,Xuanhe127; Zheng,Yuanjin128; Zheng,Yu Qing129; Zheng,Zijian130; Zhou,Tao131; Zhu,Bowen132; Zhu,Ming133; Zhu,Rong134; Zhu,Yangzhi135; Zhu,Yong136; Zou,Guijin30; Chen,Xiaodong1,137
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通讯作者 | Chen,Xiaodong |
发表日期 | 2023-03-09
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DOI | |
发表期刊 | |
ISSN | 1936-0851
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EISSN | 1936-086X
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卷号 | 17页码:5211-5295 |
摘要 | Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity. ; Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity. |
关键词 | Bioelectronics
Body Area Sensor Networks
Conformable Sensors
Flexible Electronics
Human-machine Interfaces
Mechanics Engineering
Soft Materials
Sustainable Electronics
Technology Translation
Bioelectronics
Body Area Sensor Networks
Conformable Sensors
Flexible Electronics
Human-machine Interfaces
Mechanics Engineering
Soft Materials
Sustainable Electronics
Technology Translation
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相关链接 | [Scopus记录] |
收录类别 | |
语种 | 英语
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重要成果 | NI期刊
; ESI热点
; ESI高被引
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学校署名 | 其他
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WOS记录号 | WOS:000979507900001
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EI入藏号 | 20231213746936
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EI主题词 | Sensor networks
; Sustainable development
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EI分类号 | Electronic Equipment, General Purpose and Industrial:715
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Scopus记录号 | 2-s2.0-85150042634
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来源库 | Scopus
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引用统计 |
被引频次[WOS]:313
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成果类型 | 期刊论文 |
条目标识符 | http://kc.sustech.edu.cn/handle/2SGJ60CL/524332 |
专题 | 工学院_材料科学与工程系 工学院_生物医学工程系 工学院_深港微电子学院 |
作者单位 | 1.Institute of Materials Research and Engineering (IMRE),Agency for Science,Technology and Research (A*STAR),Singapore,2 Fusionopolis Way, #08-03 Innovis,138634,Singapore 2.Innovative Centre for Flexible Devices (iFLEX),School of Materials Science and Engineering,Nanyang Technological University,Singapore,639798,Singapore 3.Department of Biomedical Engineering,University of Houston,Houston,77024,United States 4.School of Electrical and Electronic Engineering,Yonsei University,Seoul,03722,South Korea 5.Department of Electrical and Computer Engineering,The University of Texas at Austin,Austin,78712,United States 6.Microelectronics Research Center,The University of Texas at Austin,Austin,78758,United States 7.Department of Chemistry and Biochemistry,California NanoSystems Institute,Department of Psychiatry and Biobehavioral Sciences,Semel Institute for Neuroscience and Human Behavior,Hatos Center for Neuropharmacology,University of California,Los Angeles,Los Angeles,90095,United States 8.Colloid Chemistry Department,Max Planck Institute of Colloids and Interfaces,Potsdam,14476,Germany 9.Department of Chemical Engineering,Stanford University,Stanford,94305,United States 10.Laboratory of Organic Electronics,Department of Science and Technology,Campus Norrko¨ping,Linko¨ping University,Linko¨ping,83,Sweden 11.Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC),Stockholm,SE-100 44,Sweden 12.Department of Materials Science and Engineering,Stanford University,Stanford,94301,United States 13.Department of Biomedical Engineering and Department of Materials Science and Engineering,Carnegie Mellon University,Pittsburgh,15213,United States 14.Department of Bioengineering,University of California,Los Angeles,Los Angeles,90095,United States 15.School of Chemistry,Chemical Engineering and Biotechnology,Nanyang Technological University,Singapore,637457,Singapore 16.Nanobionics Group,Department of Chemical and Biological Engineering,Monash University,Clayton,3800,Australia 17.Monash Institute of Medical Engineering,Monash University,Clayton,3800,Australia 18.Applied Mechanics Laboratory,Department of Engineering Mechanics,Laboratory of Flexible Electronics Technology,Tsinghua University,Beijing,100084,China 19.Division of Materials of Science and Engineering,Hanyang University,Seongdong-gu,222 Wangsimni-ro, Seoul,04763,South Korea 20.School of Mechanical Engineering,Purdue University,West Lafayette,47906,United States 21.Media Lab,Massachusetts Institute of Technology,Cambridge,02139,United States 22.Beijing National Laboratory for Molecular Sciences,CAS Key Laboratory of Organic Solids,Institute of Chemistry,Chinese Academy of Sciences,Beijing,100190,China 23.Department of Chemical and Biomolecular Engineering,North Carolina State University,Raleigh,27606,United States 24.Department of Chemistry and Biochemistry,California NanoSystems Institute,University of California,Los Angeles,Los Angeles,90095,United States 25.Department of Chemistry and the Materials Research Center,Northwestern University,Evanston,60208,United States 26.Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering,The Hong Kong University of Science and Technology,Kowloon,Clear Water Bay, Hong Kong SAR,Hong Kong 27.State Key Laboratory of Molecular Engineering of Polymers,Department of Macromolecular Science,Laboratory of Advanced Materials,Fudan University,Shanghai,200438,China 28.Laboratory of Flexible Electronics Technology,Department of Engineering Mechanics,Tsinghua University,Beijing,100084,China 29.School of Mechanical and Aerospace Engineering,Nanyang Technological University,Singapore,639798,Singapore 30.Institute of High Performance Computing (IHPC),Agency for Science,Technology and Research (A*STAR),Singapore,1 Fusionopolis Way, #16-16 Connexis,138632,Singapore 31.Andrew and Peggy Cherng Department of Medical Engineering,California Institute of Technology,Pasadena,91125,United States 32.Department of Chemical Engineering,Department of Materials Science and Engineering,Department of Electrical Engineering and Computer Science,Applied Physics Program,and Macromolecular Science and Engineering Program,University of Michigan,Ann Arbor,48109,United States 33.Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen,518055,China 34.National Key Laboratory of Science and Technology on Micro/Nano Fabrication,School of Electronic Information and Electrical Engineering,Shanghai Jiao Tong University,Shanghai,200240,China 35.Institute for Health Innovation and Technology,National University of Singapore,Singapore,117599,Singapore 36.Department of Electrical and Computer Engineering,National University of Singapore,Singapore,117583,Singapore 37.The N.1 Institute for Health,National University of Singapore,Singapore,117456,Singapore 38.School of Electronics and Center for Carbon-Based Electronics,Peking University,Beijing,100871,China 39.School of Fashion and Textiles,The Hong Kong Polytechnic University,Kowloon,Hung Hom, Hong Kong SAR,Hong Kong 40.Department of Materials Science and Engineering,California NanoSystems Institute,University of California,Los Angeles,Los Angeles,90095,United States 41.Key Laboratory of Flexible Electronics (KLOFE),Institute of Advanced Materials (IAM),Nanjing Tech University (NanjingTech),Nanjing,30 South Puzhu Road,211816,China 42.mmh Labs,Elmore Family School of Electrical and Computer Engineering,Purdue University,West Lafayette,47906,United States 43.Electrical Engineering and Computer Sciences,University of California,Berkeley,94720,United States 44.Materials Sciences Division,Lawrence Berkeley National Laboratory,Berkeley,94720,United States 45.Department of Materials Science and Engineering,Pohang University of Science and Engineering (POSTECH),Pohang,Gyeong-buk,37673,South Korea 46.Department of Electronic Engineering,Tsinghua University,Beijing,100084,China 47.Department of Biomedical Engineering,Southern University of Science and Technology,Shenzhen,No 1088, Xueyuan Road, Guangdong,518055,China 48.Department of Materials Science and Engineering,Korea Advanced Institute of Science and Technology (KAIST),Daejeon,34141,South Korea 49.Research Center for Materials,Architectures and Integration of Nanomembranes (MAIN),Chemnitz University of Technology,Chemnitz,09126,Germany 50.Terasaki Institute for Biomedical Innovation,Los Angeles,United States 51.Center for Nanoparticle Research,Institute for Basic Science (IBS),School of Chemical and Biological Engineering,Seoul National University,Seoul,08826,South Korea 52.Department of Materials Science and Engineering,Korea Advanced Institute of Science and Technology (KAIST),Daejeon,291 Daehak-ro,34141,South Korea 53.Center for Intelligent Sensors and MEMS (CISM),National University of Singapore,Singapore,117608,Singapore 54.National University of Singapore Suzhou Research Institute (NUSRI),Suzhou,Suzhou Industrial Park,215123,China 55.NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP),National University of Singapore,Singapore,119077,Singapore 56.School of Advanced Materials Science and Engineering,Sungkyunkwan University,Suwon,Kyunggi-do,16419,South Korea 57.School of Materials Science and Engineering,Nanyang Technological University,Singapore,639798,Singapore 58.Singapore-HUJ Alliance for Research and Enterprise (SHARE),Campus for Research Excellence and Technological Enterprise (CREATE),Singapore,138602,Singapore 59.Department of Materials Science and Engineering,Seoul National University,Seoul,08826,South Korea 60.School of Chemical and Biological Engineering,Seoul National University,Seoul,08826,South Korea 61.Institute of Engineering Research,Research Institute of Advanced Materials,Seoul National University,Seoul,08826,South Korea 62.Interdisciplinary Program in Bioengineering,Seoul National University,Seoul,08826,South Korea 63.College of Chemistry and Materials Science,Jinan University,Guangzhou,Guangdong,510632,China 64.Department of Biomedical Engineering,Department of Electrical and Computer Engineering,Neuroscience Program,BioMolecular Science Program,Institute for Quantitative Health Science and Engineering,Michigan State University,East Lansing,48823,United States 65.School of Chemistry and Chemical Engineering,Harbin Institute of Technology,Harbin,Heilongjiang,150001,China 66.Department of Biomedical Engineering,National University of Singapore,Singapore,117583,Singapore 67.Mechanobiology Institute,National University of Singapore,Singapore,117411,Singapore 68.Institute for Health Innovation and Technology,National University of Singapore,Singapore,119276,Singapore 69.School of Microelectronics,Southern University of Science and Technology,Shenzhen,518055,China 70.Department of Nano and Chemical Engineering,University of California,San Diego,La Jolla,92093-0448,United States 71.John A. Paulson School of Engineering and Applied Sciences,Harvard University,Boston,02134,United States 72.School of Chemistry and Chemical Engineering,Frontiers Science Center for Transformative Molecules,Shanghai Jiao Tong University,Shanghai,200240,China 73.Beijing Key Laboratory of Energy Conversion and Storage Materials,College of Chemistry,Beijing Normal University,Beijing,100875,China 74.Department of Biomedical Engineering,N.1 Institute for Health,Institute for Health Innovation and Technology (iHealthtech),National University of Singapore,Singapore,119077,Singapore 75.Department of Mechanical and Aerospace Engineering,North Carolina State University,Raleigh,27695,United States 76.Neural Engineering Centre,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen,518055,China 77.Department of Aerospace Engineering and Engineering Mechanics,Department of Electrical and Computer Engineering,Department of Mechanical Engineering,Department of Biomedical Engineering,Texas Materials Institute,The University of Texas at Austin,Austin,78712,United States 78.Institute of Chemistry and the Center for Nanoscience and Nanotechnology,The Hebrew University of Jerusalem,Jerusalem,9190401,Israel 79.Electrical Engineering Division,Department of Engineering,University of Cambridge,Cambridge,CB3 0FA,United Kingdom 80.Institute of Industrial Science,The University of Tokyo,Meguro-ku,4-6-1 Komaba, Tokyo,153-8505,Japan 81.Darwin College,University of Cambridge,Cambridge,CB3 9EU,United Kingdom 82.Department of Biomedical Engineering,Rutgers University,Piscataway,08854,United States 83.School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology,Sungkyunkwan University,Suwon,16419,South Korea 84.Department of Materials Science and Engineering,Department of Mechanical and Aerospace Engineering,California NanoSystems Institute,University of California,Los Angeles,Los Angeles,90095,United States 85.Department of Chemistry and Biochemistry,University of California,Los Angeles,Los Angeles,90095,United States 86.Querrey Simpson Institute for Bioelectronics,Northwestern University,Evanston,60208,United States 87.Department of Materials Science and Engineering,Department of Mechanical Engineering,Department of Biomedical Engineering,Departments of Electrical and Computer Engineering and Chemistry,Department of Neurological Surgery,Northwestern University,Evanston,60208,United States 88.Becton,Dickinson and Company,Anaheim,1268 N. Lakeview Avenue,92807,United States 89.Ready,Set,Food!,Encino,15821 Ventura Blvd #450,91436,United States 90.Material Systems for Nanoelectronics,Chemnitz University of Technology,Chemnitz,09107,Germany 91.Nanophysics,Faculty of Physics,TU Dresden,Dresden,01062,Germany 92.The Institute of Scientific and Industrial Research (SANKEN),Osaka University,Osaka,5670047,Japan 93.School of Integrated Circuits and Electronics,Beijing Institute of Technology,Beijing,100081,China 94.Department of Electronic Engineering,Beijing National Research Center for Information Science and Technology,Institute for Precision Medicine,Center for Flexible Electronics Technology,IDG/McGovern Institute for Brain Research,Tsinghua University,Beijing,100084,China 95.Department of Electrical Engineering and Information Systems,Graduate School of Engineering,The University of Tokyo,Tokyo,113-8656,Japan 96.Key Laboratory of Green Printing,Institute of Chemistry,Chinese Academy of Sciences,Beijing,Beijing,100190,China 97.Laboratory of Organic Electronics,Department of Science and Technology,Linko¨ping University,Norrkoping,SE-601 74,Sweden 98.Department of Physics and Electronics,Osaka Metropolitan University,Sakai,Osaka,599-8531,Japan 99.Research Institute for Intelligent Wearable Systems,School of Fashion and Textiles,Hong Kong Polytechnic University,Hong Kong 100.Materials Science and Engineering,National University of Singapore,Singapore,117575,Singapore 101.iHealthtech,National University of Singapore,Singapore,119276,Singapore 102.Singapore Hybrid-Integrated Next-Generation µ-Electronics Centre (SHINE),Singapore,117583,Singapore 103.School of Electronic Science and Engineering,Nanjing University,Nanjing,210023,China 104.Department of Biomedical Engineering,University of Texas at Austin,Austin,78712,United States 105.Department of Nanoengineering,University of California,San Diego,92093,United States 106.Frontier Institute of Chip and System,State Key Laboratory of Integrated Chip and Systems,Zhangjiang Fudan International Innovation Center,Fudan University,Shanghai,200433,China 107.The Shanghai Qi Zhi Institute,Shanghai,41th Floor, AI Tower, No.701 Yunjin Road,200232,China 108.Pritzker School of Molecular Engineering,The University of Chicago,Chicago,60637,United States 109.State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors,Institute of Advanced Materials (IAM),Nanjing University of Posts and Telecommunications,Nanjing,9 Wenyuan Road,210023,China 110.Beijing Institute of Nanoenergy and Nanosystems,Chinese Academy of Sciences,Beijing,100083,China 111.Georgia Institute of Technology,Atlanta,30332-0245,United States 112.California NanoSystems Institute,Department of Chemistry and Biochemistry,Department of Bioengineering,and Department of Materials Science and Engineering,University of California,Los Angeles,Los Angeles,90095,United States 113.Institute of Flexible Electronics Technology of THU,Jiaxing,Zhejiang,314000,China 114.Department of Nanoengineering,Department of Electrical and Computer Engineering,Materials Science and Engineering Program,Department of Bioengineering,University of California San Diego,La Jolla,92093,United States 115.School of Biomedical Engineering,Health Science Center,Shenzhen University,Shenzhen,Guangdong,518060,China 116.Tianjin Key Laboratory of Molecular Optoelectronic Sciences,Department of Chemistry,School of Science,Tianjin University,Tianjin,300072,China 117.Department of Materials Science and Engineering,National University of Singapore (NUS),Singapore,9 Engineering Drive 1,117575,Singapore 118.School of Biomedical Sciences,Faculty of Biological Sciences,University of Leeds,Leeds,LS2 9JT,United Kingdom 119.School of Materials Science and Engineering,The Key Laboratory of Advanced Materials of Ministry of Education,State Key Laboratory of New Ceramics and Fine Processing,Center for Flexible Electronics Technology,Tsinghua University,Beijing,100084,China 120.Department of Engineering Science and Mechanics,Department of Biomedical Engineering,Department of Material Science and Engineering,Materials Research Institute,Pennsylvania State University,University Park,16802,United States 121.Materials Science and Engineering Program,Walker Department of Mechanical Engineering,The University of Texas at Austin,Austin,78712,United States 122.Department of Chemistry,Institute of Biomimetic Materials and Chemistry,Hefei National Research Center for Physical Science at the Microscale,University of Science and Technology of China,Hefei,230026,China 123.Department of Biomedical Engineering,City University of Hong Kong,Hong Kong 124.National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Peking University,Beijing,100871,China 125.Beijing Advanced Innovation Center for Integrated Circuits,School of Integrated Circuits,Peking University,Beijing,100871,China 126.School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu,611731,China 127.Department of Mechanical Engineering,Department of Civil and Environmental Engineering,Massachusetts Institute of Technology,Cambridge,02139,United States 128.Center for Integrated Circuits and Systems,School of Electrical and Electronic Engineering,Nanyang Technological University,Singapore,50 Nanyang Avenue,639798,Singapore 129.National Key Laboratory of Science and Technology on Micro/Nano Fabrication;,School of Integrated Circuits,Peking University,Beijing,100871,China 130.Department of Applied Biology and Chemical Technology,Faculty of Science,Research Institute for Intelligent Wearable Systems,Research Institute for Smart Energy,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong 131.Center for Neural Engineering,Department of Engineering Science and Mechanics,The Huck Institutes of the Life Sciences,Materials Research Institute,The Pennsylvania State University,University Park,16802,United States 132.Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province,School of Engineering,Westlake University,Hangzhou,310024,China 133.Institute for Digital Molecular Analytics and Science (IDMxS),Nanyang Technological University,Singapore,59 Nanyang Drive,636921,Singapore 134.Department of Precision Instrument,Tsinghua University,Beijing,100084,China 135.Terasaki Institute for Biomedical Innovation,Los Angeles,90064,United States 136.Department of Mechanical and Aerospace Engineering,Department of Materials Science and Engineering,Department of Biomedical Engineering,North Carolina State University,Raleigh,27695,United States 137.Innovative Center for Flexible Devices (iFLEX),Max Planck-NTU Joint Laboratory for Artificial Senses,School of Materials Science and Engineering,Nanyang Technological University,Singapore,639798,Singapore |
推荐引用方式 GB/T 7714 |
Luo,Yifei,Abidian,Mohammad Reza,Ahn,Jong Hyun,et al. Technology Roadmap for Flexible Sensors[J]. ACS Nano,2023,17:5211-5295.
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APA |
Luo,Yifei.,Abidian,Mohammad Reza.,Ahn,Jong Hyun.,Akinwande,Deji.,Andrews,Anne M..,...&Chen,Xiaodong.(2023).Technology Roadmap for Flexible Sensors.ACS Nano,17,5211-5295.
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MLA |
Luo,Yifei,et al."Technology Roadmap for Flexible Sensors".ACS Nano 17(2023):5211-5295.
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