题名 | Heat and fluid flow in high-power LED packaging and applications |
作者 | |
通讯作者 | Luo, Xiaobing |
发表日期 | 2016-09
|
DOI | |
发表期刊 | |
ISSN | 0360-1285
|
EISSN | 1873-216X
|
卷号 | 56页码:1-32 |
摘要 | Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and then transmitted or conducted through multiple packaging materials and interfaces. Part of the transmitted light converts into heat along the light propagation; in return, the accumulation of heat leads to the degradation of light output. The accumulated heat negatively influences the reliability and longevity of LEDs, and thus thermal management is critical for LED packaging and applications. On the other hand, in LED packaging processes, many fluid flow problems exist, such as phosphor coating, silicone injection, chip bonding, solder reflow, etc. Among them, phosphor coating is the most important process which is essential for LED performance. Phosphor gel is a kind of non-Newton fluid and its coating process is a typical fluid-flow problem. Overall, since LED packaging and applications present many heat and fluid flow problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and designs. In this review, the emphasis is placed on heat generation in chips, heat flow in packages and application products, fluid flow in phosphor coating process, etc. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art LED packaging and application technologies. (C) 2016 Elsevier Ltd. All rights reserved. |
关键词 | |
相关链接 | [来源记录] |
收录类别 | |
语种 | 英语
|
重要成果 | ESI高被引
|
学校署名 | 其他
|
资助项目 | 973 Project of the Ministry of Science and Technology of China[2011CB013105]
|
WOS研究方向 | Thermodynamics
; Energy & Fuels
; Engineering
|
WOS类目 | Thermodynamics
; Energy & Fuels
; Engineering, Chemical
; Engineering, Mechanical
|
WOS记录号 | WOS:000381531900001
|
出版者 | |
EI入藏号 | 20162402496949
|
EI主题词 | Chip scale packages
; Coatings
; Heat generation
; Interfaces (materials)
; Light emission
; Light emitting diodes
; Packaging materials
; Phosphors
; Silicones
; Soldering
; Temperature control
; Thermal management (electronics)
|
EI分类号 | Soldering:538.1.1
; Fluid Flow, General:631.1
; Packaging Materials:694.2
; Semiconductor Devices and Integrated Circuits:714.2
; Specific Variables Control:731.3
; Light/Optics:741.1
; Coating Materials:813.2
; Organic Polymers:815.1.1
; Materials Science:951
|
ESI学科分类 | ENGINEERING
|
来源库 | Web of Science
|
引用统计 |
被引频次[WOS]:380
|
成果类型 | 期刊论文 |
条目标识符 | http://kc.sustech.edu.cn/handle/2SGJ60CL/29473 |
专题 | 工学院_电子与电气工程系 |
作者单位 | 1.Huazhong Univ Sci & Technol, Sch Energy & Power Engn, State Key Lab Coal Combust, Wuhan 430074, Peoples R China 2.Wuhan Univ, Sch Power & Mech Engn, Wuhan 430073, Peoples R China 3.South Univ Sci & Technol China, Dept Elect & Elect Engn, Shenzhen 518055, Peoples R China |
推荐引用方式 GB/T 7714 |
Luo, Xiaobing,Hu, Run,Liu, Sheng,et al. Heat and fluid flow in high-power LED packaging and applications[J]. PROGRESS IN ENERGY AND COMBUSTION SCIENCE,2016,56:1-32.
|
APA |
Luo, Xiaobing,Hu, Run,Liu, Sheng,&Wang, Kai.(2016).Heat and fluid flow in high-power LED packaging and applications.PROGRESS IN ENERGY AND COMBUSTION SCIENCE,56,1-32.
|
MLA |
Luo, Xiaobing,et al."Heat and fluid flow in high-power LED packaging and applications".PROGRESS IN ENERGY AND COMBUSTION SCIENCE 56(2016):1-32.
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条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | 操作 | |
Luo-2016-Heat and fl(8154KB) | -- | -- | 限制开放 | -- |
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