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QUAN Chen
Assistant Professor
15546891485
chenq3@sustech.edu.cn

Dr. Chen Quan graduated from the Department of Electrical and Electronic Engineering at the University of Hong Kong. He was then a postdoctoral fellow at the University of California, San Diego (UCSD) and a research assistant professor at the University of Hong Kong. In 2019, he joined the School of Microelectronics, Southern University of Science and Technology as an assistant professor. Dr. Chen focuses on large-scale analog/RF circuit simulation, multiphysics analysis, and quantum mechanical first-principles simulation of advanced nanodevices in electronic design automation (EDA). He has received the 2012 ICCAD Best Paper Award Nomination and the second prize of the 2020 Wu Wenjun Artificial Intelligence Chip Award, and was selected for the Shenzhen Peacock Team. He is leading or participating in multiple government-funded projects, including the Key and the Special Programs of NSFC and the Key R&D Program of Guangdong Province, as well as several industrial collaborative projects. He has rich experience in EDA technology transfer and commercialization.


Education 

Doctor of Philosophy, Electronic and Electrical Engineering        Sep. 2010

The University of Hong Kong, Supervisor: Prof. Ngai Wong

Master of Philosophy, Electronic and Electrical Engineering      Sep. 2007

The University of Hong Kong, Supervisor: Prof. Ngai Wong

Bachelor of Science, Electronic and Communication Engineering      Jun. 2005

Sun Yat-Sen (Zhongshan) University

 

Employment 

Assistant Professor, School of Microelectronics, the Southern University of Science and Technology (SUSTech)         Apr. 2019 - Present

Research Assistant Professor, Department of Electronic and Electrical Engineering, the University of Hong Kong (HKU)          Nov. 2012 - Mar. 2019

Postdoctoral Fellow, Department of Electronic and Electrical Engineering, the University of Hong Kong (HKU)                     Dec. 2011 - Oct. 2012

Research Associate, Department of Electrical Engineering, the Hong Kong Polytechnic University (PolyU)     Nov. 2011 - Dec. 2011

Postdoctoral Fellow, Department of Computer Science and Engineering, University of California, San Diego (UCSD)                   Oct. 2010 - Oct. 2011


Research Interests 

Large-scale multi-domain modeling and simulation for EDA in nanoelectronics and power electronics applications.

 

Research Grants 

  1. “An efficient tightly-coupled multi-physics simulation framework for microelectronics” (PI), General Research Fund (GRF) from Hong Kong Research Grants Council (RGC), HK$ 500K (Award date: 30 Jun 2013, 24 months).

  2. “ Multi-physics ageingsimulation for microelectronics” (PI), HKU Seed Funding Programme for Basic Research, HK$ 45K (Award date: 7 Mar 2017, 24 months).

  3. “ A multi-physics modelingand simulation platform of organic light-emitting diodes in display applications” (PI), HKU Seed Funding Programme for Basic Research, HK$ 46K (Award date: 15 Mar 2016, 24 months).

  4. “Time-domain electromagnetic-semiconductor-thermal co-simulation framework with model order reduction support”(PI), HKU Seed Funding Programme for Basic Research, HK$ 240K (Award date: 25 Jan 2013, 24 months).


Entrepreneurship Experiences and Awards 

  1. Founder & Senior Scientist of QuantumFabless Ltd, Nov. 2017.

  2. Awardee of “Cyberport Incubation Programme”, Hong Kong Cyberport, HK$ 500K, 2019 (24 months).

  3. Awardee of “Technology Start-up Support Scheme for Universities (TSSSU)” at HKU, Innovation and Technology Commission (ITC) of Hong Kong, HK$ 650K,2019 (12 months).

  4. Awardee of “Technology Start-up Support Scheme for Universities (TSSSU)” at HKU, Innovation and Technology Commission (ITC) of Hong Kong, HK$ 250K,2018 (12 months).

  5. Awardee of “Cyberport Creative Micro Fund (CCMF)”, Hong Kong Cyberport, HK$ 100K, 2018 (6 months).

  6. 2ndprize (5th place in 33 teams) in the national start-up competition “京津冀-粤港澳(国际)青年创新创业大赛”, Beijing, Oct. 2018.

  7. 2ndprize, (2nd place in 10 teams) in the national start-up competition “2018 “创客中国”智慧芯片设计与应用创新创业大赛”, Nanjing, Nov. 2018.

  8. External business plan reviewer of Hong Kong X-Tech Startup Platform, since 2017

 

Research Publications 

1. Y. Tong and Q. Chen, "Analytical Modeling of Multiple Co-Existing Inaccuracies in RF Controlling Circuits for Superconducting Quantum Computing," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, doi: 10.1109/TCAD.2023.3311732

2. C. Wang, D. Yang, J. Lyu, Y. Dai, C. Zhuo and Q. Chen, "On Model Order Reduction and Exponential Integrator for Transient Circuit Simulation," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, doi: 10.1109/TCAD.2023.3309734.

3. C. Wang, D. Yang and Q. Chen, “EI-MOR: A Hybrid Exponential Integrator and Model Order Reduction Approach for Transient Power/Ground Network Analysis”, in Proc. Intl. Conf. on Computer-Aided Design (ICCAD), San Diego, Nov. 2022

4. D. Liu and Q. Chen, “TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs,” in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2022.

5. Q. Chen, “EI-NK: A Robust Exponential Integrator Method with Singularity Removal and Newton-Raphson Iterations for Transient Nonlinear Circuit Simulation”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 6, pp. 1693-1703, June 2022.

6. T. Hou, P. Zhen, N. Wong; Q. Chen, G. Shi, S. Wang and H. B. Chen “Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires,” in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), May 2022.

7. T. Hou, N. Wong, Q. Chen, Z. Ji and H. -B. Chen, “A Space-Time Neural Network for Analysis of Stress Evolution under DC Current Stressing,” in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, (TCAD), Apr. 2022.

8. M. Zhang, J. Li, C. Yang, and Q. Chen, “Deflated Restarting of Exponential Integrator Method with an Implicit Regularization for Efficient Transient Circuit Simulation,” Electronics, vol. 10, no. 9, p. 1124, May 2021.

9. Q. Chen, “A Robust Exponential Integrator Method for Generic Nonlinear Circuit Simulation”, Design Automation Conference (DAC), San Francisco, Jul. 2020

10. Chen, W. Schoenmaker, S.-H. Weng, C.-K. Cheng, G.-H. Chen, L.-J. Jiang and N. Wong, “A fast time-domain EM-TCAD coupled simulation framework via matrix exponential with stiffness reduction,” Intl. Journal of Circuit Theory and Applications (IJCTA), vol. 44, no. 4, pp. 833-850, Apr. 2016.

11. Zhuang, X. Wang, Q. Chen, P. Chen, and C.K. Cheng, “From Circuit Theory, Simulation to SPICE_Diego: A Matrix Exponential Approach for Time-Domain Analysis of Large-Scale Circuits,” IEEE Circuits and Systems Magazine, pp. 16-34, issue 2, 2016. (Invited Paper)

12. G. Mei, W. Schoenmaker and Q. Chen, “An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 35, no. 5, pp. 832-843, Oct. 2015.

13. Chen, J. Li, C. Y. Yam, Y. Zhang, N. Wong and G. H. Chen, “An approximate framework for quantum transport calculation with model order reduction”, Journal of Computational Physics (JCP), 286, pp. 49-61, 2015.

14. Schoenmaker, Q. Chen and P. Galy, “Computation of self-induced magnetic field effects including the Lorentz force for fast-transient phenomena in integrated-circuit devices”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 33, no. 6, pp. 893-902, Jun. 2014.

15. Meng, Z. Yin, C. Y. Yam, S. Koo, Q. Chen, N. Wong and G. H. Chen, “Frequency-domain multiscale quantum mechanics/electromagnetics simulation method”, Journal of Computational Chemistry (JCC), vol. 139, no. 24, pp. 244111, Dec. 2013.

16. Y. Yam, J. Peng, Q. Chen, S. Markov, J. Z. Huang, N. Wong, W. C. Chew and G. H. Chen, “A multi-scale modeling of junctionless field-effect transistors”, Applied Physics Letters (APL), vol. 103, no. 6, pp. 062109 (1-5), Aug. 2013.

17. Q. Chen, S. L. Ho and W. N. Fu, “A new low radiation wireless transmission system in mobile phone application based on magnetic resonant coupling”, IEEE Trans. on Magnetics (TMAG), vol. 49, no. 7, pp. 3476-3479, Jul. 2013.

18. Q. Chen, W. Schoenmaker, G. H. Chen, L. J. Jiang and N. Wong, “A numerically efficient formulation for time-domain electromagnetic-semiconductor co-simulation for fast-transient systems”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 32, no. 5, pp. 802-806, May 2013.

19. Q. Chen, S. L. Ho, and W. N. Fu, “Numerical investigation of magnetic resonant coupling technique in inter-chip communication via electromagnetics-TCAD coupled simulation”, IEEE Trans. on Magnetics (TMAG), vol. 48, no. 11, pp. 4253-4256, Oct. 2012.

20. H. Weng, Q. Chen, and C. K. Cheng, “Time-domain analysis of large-scale circuits by matrix exponential method with adaptive control”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 31, no. 8, pp. 1180-1193, Aug. 2012.

21. Q. Chen, S. H. Weng, and C. K. Cheng, “A practical regularization technique for modified nodal analysis in large-scale time-domain circuit simulation”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 31, no. 7, pp. 1031-1040, Jul. 2012.

22. Meng, C. Y. Yam, S. Koo, Q. Chen, N. Wong, and G. H. Chen, “Dynamic multiscale quantum mechanics/electromagnetics simulation method”, Journal of Chemical Theory and Computation (JCTC), vol. 8, no. 4, pp. 1190-1199, Feb. 2012.

23. Y. Yam, L. Y. Meng, G. H. Chen, Q. Chen and N. Wong, “Multiscale quantum mechanics/electromagnetics simulation for electronic devices”, Journal of Physical Chemistry Chemical Physics (PCCP), vol. 13, no. 32, pp. 14365-14369, Jun. 2011. (Invited Paper)

24. Chen, W. Schoenmaker, P. Meuris and N. Wong, “An effective formulation of coupled electromagnetic-TCAD simulation for extremely high frequency onwards”, IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 30, no. 6, pp. 866-876, Jun. 2011.

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